SP3 Plus is pleased to offer customisable Multi-Chip Ceramic SMDs from EPIGAP.
EPIGAP’s product management team has analysed the performance of a variety of LED chips in different setups. Based on a multitude of tests and measurements new and astonishing results have been discovered. By mounting bare dies of different wavelengths on an open TO-can as references and on EPIGAP’s new SMD ceramic package, our team was able to analyse and compare the performance of these chips. The advantages of a compact SMD housing – such as the easy mounting in the soldering process – are obvious, but can every bare die profit from the excellent thermal conductivity of the Al2O3 ceramic packaging in equal measure? Different chips ranging from 380 nm – 1650 nm have been used in these tests and according to their P-Njunction we distinguished between surface – and volume emitters. It was proven that the SMD ceramic packaging allows consistently higher and more linear currents – open TOcan with up to 50 mA versus SMD with 80 – 100 mA.
